- All sections
- B - Performing operations; transporting
- B01B - Boiling; boiling apparatus
- B01B 1/06 - Preventing bumping
Patent holdings for IPC class B01B 1/06
Total number of patents in this class: 14
10-year publication summary
|
2
|
0
|
1
|
0
|
0
|
1
|
0
|
0
|
1
|
0
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| National Research Council of Canada | 1545 |
2 |
| Samsung Display Co., Ltd. | 30585 |
1 |
| Mitsubishi Heavy Industries, Ltd. | 8217 |
1 |
| FUJIFILM Corporation | 27102 |
1 |
| The United States of America as represented by the Secretary of the Navy | 2734 |
1 |
| HORIBA STEC, Co., Ltd. | 302 |
1 |
| Hysytech S.r.l. | 4 |
1 |
| Immersion Corporation | 586 |
1 |
| Institut fur Mikrotechnik Mainz GmbH | 28 |
1 |
| L'Air Liquide, Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges Claude | 3515 |
1 |
| PURITY AB | 3 |
1 |
| Tinman Inc. | 5 |
1 |
| Edwards Semiconductor Solutions LLC | 16 |
1 |
| Other owners | 0 |